ATLAS Inner TracKer module prototypes: assembly and test

  • Data: dal 11 luglio 2019 alle 16:00 al 16 luglio 2019 alle 18:00

  • Luogo: Aula D, via Irnerio 46, Bologna

Contatto di riferimento:

Partecipanti: Dr Alessandro Lapertosa: Universita` di Genova

Abstract:

The current Inner Detector of the ATLAS experiment will be replaced with a new, all-silicon detector to cope with the tough environment of the High Luminosity LHC (HL-LHC). The instantaneous luminosity of HL-LHC (a factor 5 to 7.5 higher than LHC) would results in harder conditions for the detector: increase in occupancy, bandwidth and radiation damage. The Inner Tracker (ITk) will consist of an inner pixel and outer strip detector aiming to provide tracking coverage up to $ |\eta|$=4. The layout of the pixel detector is now finalized with five layers of pixel silicon sensor modules in the central region and several ring-shaped layers in the forward region. Due to their radiation hardness, 3D sensors are a promising option for the innermost pixel layer while in the other layers planar sensors will be used. The pixel modules are being developed and tested, the design involves smaller pitch (e.g., 50$\times$50 or 25$\times$100 $\mu$m$^2$), reduced active thickness ($\sim$ 100-150 $\mu$m) and lower power consumption with respect to the modules installed in the ATLAS Inner Detector. All hybrid detector modules will be read out by a new front-end chip, developed within the RD53 Collaboration, connected to the silicon sensors using bump bonding (bump bond density: 4∙10$^4$ pixels per cm$^2$). In this talk will present the latest ITk detector layout. Moreover I will discuss the current status of the assembly of ITk pixel module prototypes and the results of the tests performed on these devices.